ASTM F487-13(2018) PDF

Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding (Withdrawn 2024)

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Title (English):

ASTM F487-13(2018)

Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding (Withdrawn 2024)

Document status:: Withdrawn
Format:: Electronic (PDF)
Number of pages:: 4
Publication date:: January 5, 2024
SKU:: ASTM F487-13(2018)

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Abstract

AbstractThis specification covers aluminum-1 % silicon alloy wire for semiconductor devices lead-bonding and is limited to wire of diameter up to and including 0.0020 in. (0.051 mm). The wire surface shall be clean and free of finger oils, ...

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ASTM F487-13(2018) PDF

Abstract

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Abstract

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