BS EN IEC 61188-6-3:2025 PDF

Circuit boards and circuit board assemblies. Design and use - Land pattern design. Description of land pattern for through hole components (THT)

Open preview (PDF)Circuit boards and circuit board assemblies. Design and use - Land pattern design. Description of land pattern for through hole components (THT)

Title (English):

BS EN IEC 61188-6-3:2025

Circuit boards and circuit board assemblies. Design and use - Land pattern design. Description of land pattern for through hole components (THT)

Document status:

Active

Format:

Electronic (PDF)

Publication date:

February 28, 2025

ICS:

31.180

Technical committee:

CENELEC

SKU:

BS EN IEC 61188-6-3:2025