BS EN IEC 61189-2-630:2018 PDF

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Moisture absorption after pressure vessel conditioning

Open preview (PDF)Test methods for electrical materials, printed board and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Moisture absorption after pressure vessel conditioning

Title (English):

BS EN IEC 61189-2-630:2018

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Moisture absorption after pressure vessel conditioning

Document status:

Active

Format:

Electronic (PDF)

Publication date:

October 31, 2018

ICS:

31.180

Technical committee:

CENELEC

SKU:

BS EN IEC 61189-2-630:2018