BS EN IEC 61189-2-801:2023 PDF

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Thermal conductivity test for base materials

Open preview (PDF)Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Thermal conductivity test for base materials

Title (English):

BS EN IEC 61189-2-801:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Thermal conductivity test for base materials

Document status:

Active

Format:

Electronic (PDF)

Publication date:

December 31, 2023

ICS:

31.180

Technical committee:

CENELEC

SKU:

BS EN IEC 61189-2-801:2023