BS EN IEC 61189-2-807:2021 PDF

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Decomposition temperature (Td) using TGA

Open preview (PDF)Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Decomposition temperature (Td) using TGA

Title (English):

BS EN IEC 61189-2-807:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Decomposition temperature (Td) using TGA

Document status:

Active

Format:

Electronic (PDF)

Publication date:

November 30, 2021

ICS:

31.180

Technical committee:

CENELEC

SKU:

BS EN IEC 61189-2-807:2021