BS EN IEC 61189-2-808:2024 PDF

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Thermal resistance of an assembly by thermal transient method

First page of standard BS EN IEC 61189-2-808:2024

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Title (English):

BS EN IEC 61189-2-808:2024

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Thermal resistance of an assembly by thermal transient method

Document status:: Active
Format:: Electronic (PDF)
Publication date:: June 30, 2024
ICS:: 31.180
Technical committee:: CENELEC
SKU:: BS EN IEC 61189-2-808:2024

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Abstract

1 Scope

This part of IEC 61189 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.

NOTE This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.

Related standards

Mentioned in the description and other BS standards

BS EN IEC 61189-2-808:2024 PDF

Abstract

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Abstract

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