BS EN IEC 61189-2-809:2025 PDF

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA

Open preview (PDF)Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA

Title (English):

BS EN IEC 61189-2-809:2025

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA

Document status:

Active

Format:

Electronic (PDF)

Publication date:

February 28, 2025

ICS:

29.035.10

Technical committee:

CENELEC

SKU:

BS EN IEC 61189-2-809:2025