BS EN IEC 61189-3-302:2025 PDF

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Open preview (PDF)Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Title (English):

BS EN IEC 61189-3-302:2025

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Document status:

Active

Format:

Electronic (PDF)

Publication date:

November 30, 2025

ICS:

31.180

Technical committee:

CENELEC

SKU:

BS EN IEC 61189-3-302:2025