BS EN IEC 61189-5-503:2017 PDF

Test methods for electrical materials, printed board and other interconnection structures and assemblies - General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards

Open preview (PDF)Test methods for electrical materials, printed board and other interconnection structures and assemblies - General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards

Title (English):

BS EN IEC 61189-5-503:2017

Test methods for electrical materials, printed board and other interconnection structures and assemblies - General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards

Document status:

Active

Format:

Electronic (PDF)

Publication date:

April 30, 2018

ICS:

31.180

Technical committee:

CENELEC

SKU:

BS EN IEC 61189-5-503:2017