BS EN IEC 61189-5-601:2021 PDF

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for…

Open preview (PDF)Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for…

Title (English):

BS EN IEC 61189-5-601:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for…

Document status:

Active

Format:

Electronic (PDF)

Publication date:

March 31, 2021

ICS:

19.080

Technical committee:

CENELEC

SKU:

BS EN IEC 61189-5-601:2021