BS EN IEC 61190-1-3:2018 PDF

Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Open preview (PDF)Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Title (English):

BS EN IEC 61190-1-3:2018

Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Document status:

Active

Format:

Electronic (PDF)

Publication date:

March 31, 2018

ICS:

31.190

Technical committee:

CENELEC

SKU:

BS EN IEC 61190-1-3:2018