BS EN IEC 61249-2-51:2023 PDF

Materials for printed boards and other interconnecting structures - Reinforced base materials, clad and unclad. Base materials for integrated circuit card carrier tape, unclad

Open preview (PDF)Materials for printed boards and other interconnecting structures - Reinforced base materials, clad and unclad. Base materials for integrated circuit card carrier tape, unclad

Title (English):

BS EN IEC 61249-2-51:2023

Materials for printed boards and other interconnecting structures - Reinforced base materials, clad and unclad. Base materials for integrated circuit card carrier tape, unclad

Document status:

Active

Format:

Electronic (PDF)

Publication date:

June 30, 2023

ICS:

29.035.10

Technical committee:

CENELEC

SKU:

BS EN IEC 61249-2-51:2023