BS EN IEC 63378-6:2026 PDF

Thermal standardization on semiconductor packages - Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points

Open preview (PDF)Thermal standardization on semiconductor packages - Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points

Title (English):

BS EN IEC 63378-6:2026

Thermal standardization on semiconductor packages - Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points

Document status:

Active

Format:

Electronic (PDF)

Publication date:

March 31, 2026

ICS:

31.080.01

SKU:

BS EN IEC 63378-6:2026