BS IEC 62047-38:2021 PDF

Semiconductor devices. Micro-electromechanical devices - Test method for adhesion strength of metal powder paste in MEMS interconnection

Open preview (PDF)Semiconductor devices. Micro-electromechanical devices - Test method for adhesion strength of metal powder paste in MEMS interconnection

Title (English):

BS IEC 62047-38:2021

Semiconductor devices. Micro-electromechanical devices - Test method for adhesion strength of metal powder paste in MEMS interconnection

Document status:

Active

Format:

Electronic (PDF)

Publication date:

July 31, 2021

ICS:

31.080.99

SKU:

BS IEC 62047-38:2021