BS IEC 62047-46:2025 PDF

Semiconductor devices. Micro-electromechanical devices - Silicon based MEMS fabrication technology. Measurement method of tensile strength of nanoscale thickness membrane

First page of standard BS IEC 62047-46:2025

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Title (English):

BS IEC 62047-46:2025

Semiconductor devices. Micro-electromechanical devices - Silicon based MEMS fabrication technology. Measurement method of tensile strength of nanoscale thickness membrane

Document status:: Active
Format:: Electronic (PDF)
Publication date:: April 30, 2025
ICS:: 31.080.99
SKU:: BS IEC 62047-46:2025

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Abstract

1 Scope This part of IEC 62047 specifies the requirements and testing method to measure the tensile strength of membrane with nanoscale thickness (length from 100 μm to 5 000 μm, width from 100 μm to 1 000 μm, thickness from 50 nm to 500 nm) which is fabricated by micromachining technology used in silicon-based micro-electromechanical system (MEMS). This document is applicable to in-situ tensile strength measurement of nanoscale thickness membrane manufactured by microelectronics technology and related micromachining technology. With the devices scaling, the tensile strength degradation, induced by defects and contaminations, becomes severer. This document specifies an in-situ testing method of the tensile strength of membrane with nanoscale thickness based on a MEMS technique. This document does not need intricate instruments (such as scanning probe microscopy and nanoindenter) and special test specimens. Since in-situ on-chip tester in this document and device are fabricated with the same process on the same wafer, this document can give some practical reference for the design part.

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BS IEC 62047-46:2025 PDF

Abstract

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Abstract

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