BS IEC 62047-52:2026 PDF

Semiconductor devices - Micro-electromechanical devices - Part 52: Biaxial tensile testing method for stretchable MEMS

First page of standard BS IEC 62047-52:2026

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Title (English):

BS IEC 62047-52:2026

Semiconductor devices - Micro-electromechanical devices - Part 52: Biaxial tensile testing method for stretchable MEMS

Document status:: Active
Format:: Electronic (PDF)
Publication date:: March 31, 2026
ICS:: 31.080.99
SKU:: BS IEC 62047-52:2026

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Abstract

1 Scope This part of IEC 62047 specifies a testing method for measuring device performance and failure strain under biaxial tensile deformation in stretchable MEMS materials. The typical examples of the stretchable MEMS materials are flexible single crystalline silicon structures, MEMS circuit boards, interconnected MEMS on a stretchable substrate. The test piece has a cruciform geometry and the test piece thickness ranges from 1 μm to 100 μm with the same thickness as the actual devices. Since the failure strain can vary depending on loading conditions like uniaxial tension and equi-biaxial tension, a biaxial load is applied to a cruciform test piece with varying strain ratio between two perpendicular loading directions.

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BS IEC 62047-52:2026 PDF

Abstract

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Abstract

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