BS IEC 62899-202-5:2018 PDF

Printed electronics - Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate

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Title (English):

BS IEC 62899-202-5:2018

Printed electronics - Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate

Document status:: Active
Format:: Electronic (PDF)
Publication date:: October 31, 2018
ICS:: 31.180
SKU:: BS IEC 62899-202-5:2018

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Abstract

What is BS IEC 62899-202-5 - conductive ink mechanical bending test about?

Printing technologies are widely used for the development of flexible and stretchable electronics as they offer a cost-effective fabrication alternative to traditional approaches. A printed conductive layer on an insulating substrate can be employed as an electrode or as an interconnect for flexible devices. BS IEC 62899-202-5 guidelines enable you to determine the bending capacity of printed conductive layers. BS IEC 62899-202-5 specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation. This sliding plate test method can be availed for practical application in the industry by enabling the long-term reliability testing of printed film.

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What is BS IEC 62899-202-5 - conductive ink mechanical bending test about?

BS IEC 62899-202-5:2018 PDF

Abstract

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Abstract

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