Overview
EN IEC 60747-15:2024 (identical to IEC 60747-15:2024) specifies requirements and test methods for isolated power semiconductor devices. It complements general semiconductor device rules in other parts of IEC 60747 and the IEC 60748 IC standards by defining additional ratings, characteristics and measurement procedures specific to discrete isolated power parts and modules. This third edition adds support for intelligent power modules (IPMs), refines thermal characterization and introduces an isolation test option for temperature sensors.
Key topics and technical requirements
- Scope and relationship: Adds device-specific requirements that are additional to other IEC 60747 parts (non‑isolated power devices) and IEC 60748 for ICs.
- Inclusion of IPMs (Annex C): Intelligent Power Semiconductor Modules are now covered, with guidance on control terminals, ratings and protection-function tests.
- Isolation requirements:
- Defined isolation voltage / isolation test procedures between terminals and baseplate.
- New optional isolation test between temperature sensor and terminals (clause 6.1.2) when agreed with the user.
- Partial discharge inception and extinction voltage measurement methods.
- Thermal and electrical characteristics:
- Thermal resistance is specified and described for each switch (clause 6.2.4), plus transient thermal impedance and test methods.
- Measurement methods for parasitic inductance and parasitic capacitance (important for switching performance).
- Tests for peak case non‑rupture current, terminal currents, and thermal compound thickness (Annex B).
- Verification and reliability:
- Detailed measurement methods (clause 6), acceptance criteria, endurance lists, type tests and routine tests (clause 7).
- Informative annexes (A–C) provide test circuits, procedures and examples (including IPM protection and switching tests).
Practical applications and users
This standard is intended for:
- Semiconductor manufacturers designing and qualifying isolated power devices (IGBTs, MOSFETs, diodes, IPMs).
- Module designers and OEMs in industrial drives, renewable inverters, traction, and power supplies who require validated isolation, thermal and switching data.
- Test laboratories and certification bodies performing type and routine tests to demonstrate compliance and safety.
- Design engineers needing standardized parameters (isolation voltage, thermal resistance, parasitics) for reliable system integration and safety verification.
Practical benefits include improved product safety, predictable thermal performance, validated isolation behavior (including sensor isolation), and harmonized test methods for reliable product qualification.
Related standards
Relevant cross-references in the document include:
Keywords: isolated power semiconductor devices, IEC 60747-15:2024, EN IEC 60747-15:2024, intelligent power module (IPM), isolation voltage, thermal resistance, parasitic inductance, partial discharge.
