IEC 60068-2-20:2008 PDF

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

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Title (English):

IEC 60068-2-20:2008

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

Document status:: Active
Format:: Electronic (PDF)
Number of pages:: 20
Publication date:: July 21, 2008
Edition:: IEC IS 60068 edition 5 version 1
ICS:: 19.040

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Description (English):

IEC 60068-2-20:2008 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. The major technical changes with regard to the fourth edition are the following: - the solder globule test is deleted; - test conditions and requirements for lead-free solders are added.

Technical details

Technical committee: TC 91 - Electronics assembly technology
SKU: IEC 60068-2-20:2008

Abstract

Overview

IEC 60068-2-20:2008 (Test T) is an international environmental test standard that defines solderability and resistance to soldering heat test methods for electronic devices with leads (through‑hole and leaded components). It specifies laboratory procedures to determine whether component leads and terminations will wet properly with solder alloys (eutectic/near‑eutectic tin‑lead or lead‑free solder) and whether component bodies can withstand the thermal load during soldering. The standard covers two principal test methods: the solder bath method and the soldering iron method.

Key Topics and Requirements

Scope and objective
- Ensures component lead/termination solderability meets solder joint requirements referenced in IEC 61191‑3 and IEC 61191‑4.
- Verifies component body resistance to soldering heat.
Test types
- Test Ta - Solderability: assesses wettability of wire and tag terminations using solder bath or soldering iron.
- Test Tb - Resistance to soldering heat: evaluates the ability of the device body and leads to tolerate soldering temperatures without damage or unacceptable changes.
Methods
- Solder bath method (simulates flow/wave soldering): defined bath composition, temperature, exposure times, fluxing and measurement/acceptance criteria.
- Soldering iron method (localized heating; used when bath method is impracticable): includes specified iron temperature (e.g., 350 °C for some procedures), solder/flux guidance and handling.
Aging and conditioning
- Optional accelerated ageing procedures prior to testing (steam ageing, damp heat, dry heat, pressurized vapour) to simulate storage or prior environmental exposure.
Lead‑free support
- Fifth edition adds test conditions and requirements for lead‑free solders and removes the solder globule test.
Measurements and failure modes
- Definitions and assessment of wetting, non‑wetting, and de‑wetting (retraction of molten solder), plus final inspection/acceptance criteria.

Applications and Who Uses It

Intended for component manufacturers, test laboratories, quality/qualification engineers, and PCB assembly/process engineers who need to:
- Validate solderability of leaded components for through‑hole and terminal soldered assemblies.
- Qualify components for lead‑free assembly processes.
- Define supplier test requirements in component specifications and procurement.
Practical use cases include incoming inspection, design verification, reliability qualification, and process change assessment for soldering operations.

Related Standards

IEC 61191‑3 / IEC 61191‑4 - Solder joint requirements for through‑hole and terminal assemblies
IEC 60068‑2‑58 - Solderability tests for SMDs
IEC 60068‑2‑54, IEC 60068‑2‑69 - Wetting/wetting‑balance and SMD methods (informative references)
IEC 60068‑1 - General guidance on environmental testing

Keywords: IEC 60068-2-20:2008, Test T, solderability, resistance to soldering heat, solder bath method, soldering iron method, lead-free solder, devices with leads, component qualification, solder joint requirements.

Related standards

Standards mentioned in the description

Abstract

Overview

Key Topics and Requirements

Scope and objective
- Ensures component lead/termination solderability meets solder joint requirements referenced in IEC 61191‑3 and IEC 61191‑4.
- Verifies component body resistance to soldering heat.
Test types
- Test Ta - Solderability: assesses wettability of wire and tag terminations using solder bath or soldering iron.
- Test Tb - Resistance to soldering heat: evaluates the ability of the device body and leads to tolerate soldering temperatures without damage or unacceptable changes.
Methods
- Solder bath method (simulates flow/wave soldering): defined bath composition, temperature, exposure times, fluxing and measurement/acceptance criteria.
- Soldering iron method (localized heating; used when bath method is impracticable): includes specified iron temperature (e.g., 350 °C for some procedures), solder/flux guidance and handling.
Aging and conditioning
- Optional accelerated ageing procedures prior to testing (steam ageing, damp heat, dry heat, pressurized vapour) to simulate storage or prior environmental exposure.
Lead‑free support
- Fifth edition adds test conditions and requirements for lead‑free solders and removes the solder globule test.
Measurements and failure modes
- Definitions and assessment of wetting, non‑wetting, and de‑wetting (retraction of molten solder), plus final inspection/acceptance criteria.

Applications and Who Uses It

Intended for component manufacturers, test laboratories, quality/qualification engineers, and PCB assembly/process engineers who need to:
- Validate solderability of leaded components for through‑hole and terminal soldered assemblies.
- Qualify components for lead‑free assembly processes.
- Define supplier test requirements in component specifications and procurement.
Practical use cases include incoming inspection, design verification, reliability qualification, and process change assessment for soldering operations.

Related Standards

IEC 61191‑3 / IEC 61191‑4 - Solder joint requirements for through‑hole and terminal assemblies
IEC 60068‑2‑58 - Solderability tests for SMDs
IEC 60068‑2‑54, IEC 60068‑2‑69 - Wetting/wetting‑balance and SMD methods (informative references)
IEC 60068‑1 - General guidance on environmental testing

IEC 60068-2-20:2008 PDF

Technical details

Abstract

Overview

Key Topics and Requirements

Applications and Who Uses It

Related Standards

Related standards

Abstract

Overview

Key Topics and Requirements

Applications and Who Uses It

Related Standards

Related standards

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