Overview
IEC 60191-6-2:2001 - Mechanical standardization of semiconductor devices, Part 6-2 - is an international design guide for preparing outline drawings of surface-mounted semiconductor device packages with ball and column terminals at 1.50 mm, 1.27 mm and 1.00 mm pitch. It standardizes the presentation and key dimensions for package types such as C‑BGA, P‑BGA, T‑BGA (ball grid arrays) and C‑CGA (column grid arrays), and defines dimensional rules for solder balls, solder columns, coplanarity and terminal position tolerances.
Key topics and requirements
- Scope and package types: Covers ball terminal packages (ceramic, plastic, tape BGAs) and column terminal packages (ceramic CGAs).
- Outline drawings: General rules for preparing consistent, unambiguous package outline drawings used in datasheets, mechanical drawings and PCB footprint libraries.
- Terminal geometry: Nominal ball/column diameters and terminal shapes for 1.00, 1.27 and 1.50 mm pitch devices (e.g., column diameters commonly specified as 0.50 mm nominal).
- Tolerance and coplanarity:
- Tolerance of solder-ball centre position: examples include y = 0.25 mm (1.00 mm pitch) and y = 0.30 mm (1.27 / 1.50 mm pitch).
- Positional tolerances X1/X2 (examples): 0.10 / 0.15 mm for 1.00 mm pitch; 0.15 / 0.20 mm for 1.27/1.50 mm pitch.
- Coplanarity limits typically given as 0.15 mm in the tables.
- Package body and stand‑off: Defines package height notation (A, A1, A2) and relationships between body thickness, lid, ball/column height and stand‑off heights. Package body thickness (A2) is treated as design specific.
- Normative reference: References the IEC 60191 family (Mechanical standardization of semiconductor devices) and follows IEC/ISO drafting conventions.
Applications and users
Who benefits:
- IC package designers and mechanical engineers creating package outlines and datasheets.
- PCB designers and component library authors building accurate land patterns and footprint definitions.
- Assembly and test engineers ensuring solderability, coplanarity and reliable reflow/wave processes.
- Manufacturers and procurement teams requiring standardized mechanical specs for supplier interchangeability and quality control.
Practical uses:
- Defining pad layouts, inspection criteria and assembly process windows.
- Creating compliant component outlines for CAD libraries and documentation.
- Reducing misalignment, soldering defects and ensuring cross-vendor compatibility.
Related standards
- IEC 60191 (all parts) - Mechanical standardization of semiconductor devices (normative reference).
- ISO/IEC drafting conventions noted in the standard’s foreword.
Keywords: IEC 60191-6-2:2001, BGA, C‑BGA, P‑BGA, T‑BGA, C‑CGA, ball grid array, column grid array, package outline drawing, surface mounted semiconductor devices, 1.00 mm pitch, coplanarity, terminal tolerance.
Open preview (PDF)Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
