Overview - IEC 60191-6-8:2001 (G‑QFP outline design guide)
IEC 60191-6-8:2001 is an International Electrotechnical Commission design guide that standardizes outline drawings and dimensional rules for the glass sealed ceramic quad flatpack (G‑QFP) surface‑mount semiconductor package. The standard defines common outline drawings, dimensional limits and recommended values so G‑QFP packages from different manufacturers are mechanically interchangeable and suitable for automated handling, gauging and PCB mounting.
Keywords: IEC 60191-6-8, G‑QFP, glass sealed ceramic quad flatpack, outline drawings, semiconductor package standardization, surface mounted.
Key topics and technical requirements
- Scope and objective: Standardize package outlines and obtain interchangeability of G‑QFP package bodies and leads.
- Package definition: G‑QFP is defined as a glass‑sealed ceramic package with gull‑wing leads extending in four directions for PCB surface mounting.
- Pin numbering and index: The index area is at the upper‑left corner when viewed from the seating plane; pin 1 is the terminal closest to the index and numbering proceeds counter‑clockwise.
- Dimension groups: Dimensions are grouped by their application:
- Group 1 - mounting and interchangeability (overall body sizes, lead pitch and positions).
- Group 2 - mounting and gauging (gauge dimensions and reference measurements).
- Group 3 - automated handling (dimensions relevant to pick‑and‑place and test fixtures).
- Group 4 - informational dimensions (e.g., seal margins).
- Pitch and lead options: The standard covers common fine pitches (examples in the document include iei = 1.00, 0.80, 0.65, 0.50, 0.40 mm) and multiple body sizes (E × D configurations).
- Datum and true position: Notes clarify datums - lead‑frame tip positions are often used as the handling datum rather than package body faces because ceramic body tolerances and glass seal protrusions can vary.
- Material/assembly notes: The design guide separates ceramic body thicknesses (base, cap, frame, lid) from the glass sealing and indicates that seal mismatching and glass protrusion are not included in some outer dimensions.
- IC package designers creating glass‑sealed ceramic QFPs.
- PCB layout and mechanical engineers defining footprints, solder land patterns and keep‑outs for G‑QFP devices.
- Manufacturers and test houses for automated handling, probe fixturing and gauging.
- Purchasing/spec writers ensuring supplier parts meet mechanical interchangeability requirements.
- Standards committees and compliance teams harmonizing component outlines across suppliers.
Related standards
- IEC 60191 (all parts) - general mechanical standardization of semiconductor devices.
For implementation, refer to the full IEC 60191‑6‑8:2001 document for complete tables, figures and exact dimensional limits and tolerances.
Open preview (PDF)Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
