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IEC 60747-17:2020 PDF

Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation

First page of standard IEC 60747-17:2020Open preview (PDF)Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation
Title (English):
IEC 60747-17:2020

Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation

Document status:
Active
Format:
Electronic (PDF)
Number of pages:
51
Publication date:
September 21, 2020
Edition:
IEC IS 60747 edition 1 version 1
ICS:
01
Description (English):

IEC 60747-17:2020 specifies the terminology, essential ratings, characteristics, safety test and the measuring methods of magnetic coupler and capacitive coupler. It specifies the principles and requirements of insulation and isolation characteristics for magnetic and capacitive couplers for basic insulation and reinforced insulation. This first edition cancels and replaces IEC PAS 60747-17:2011. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to IEC PAS 60747-17:2011: a) introduced lifetime safety factors for improved life time consideration, to comply with widely recognized aging mechanisms of silicone dioxide (TDDB) and thin film polymer isolation layers; b) significantly improved "end of life testing" paragraph and statistical life time consideration by adding detailed description on process, safety factors, methods of generating data points and respective lifetime interpolations as well as being specific on minimum amount of samples required; c) introduced concept of certification by similarity, including Annex A, giving guidance on qualification considerations and required certification process; d) alternative pulse shape allowed for surge pulse testing, to avoid issues due to surge tester availability; e) various improvements throughout the standard: definitions, for example type of coupler have been improved, introduction of surge impulse VIMP rating, usage of glass transition temperature, pre-conditioning have been redefined for improved usability and better compatibility with today’s design and functionality of couplers, available mold compounds, etc. The contents of the corrigendum of January 2021 have been included in this copy.

Technical details

Technical committee
SC 47E - Discrete semiconductor devices
SKU
IEC 60747-17:2020

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