Overview
IEC 60748-23-5:2003 is an IEC standard for manufacturing line certification and the procedure for qualification approval of high‑quality hybrid integrated circuits and film structures. It applies to hybrids (fully or partly completed) that incorporate customer‑specific quality and reliability requirements and whose acceptance is based on formal Qualification Approval. The standard complements IEC 60748-23-1 by specifying schedules, sampling and administrative procedures used by National Standards Institutions (NSIs) and manufacturers for certification.
Key topics and requirements
- Scope and applicability: Targets high‑quality hybrids with films; devices may be solder‑assembled, bare die, unencapsulated or non‑hermetic.
- Qualification approval process: Manufacturers apply to the NSI following QC 001002-3 (IECQ rules). Approval requires submission of test reports and conformity with the detail specification derived from the included Blank Detail Specification (BDS).
- Q‑PALS (Qualification‑Product Assessment Level Schedules): Prescribes grouped tests (Group A–D) for initial, lot‑by‑lot (release) and periodic (maintenance) assessments. Q‑PALS are based on IEC 60748-23-1 PALS and include device screening, lot sampling, design evaluation and periodic tests.
- Testing and sampling: Tests are selected from IEC 60748-23-1. Sampling must represent the range of circuits; tests are conducted in a defined order and failures counted per group. Example items shown include electrical tests, visual inspection, solderability, robustness of terminations and resistance to solder heat.
- Structural similarity: Enables grouping of similar circuit types for assessment if they share function, design rules, processes, materials and added components; the Designated Management Representative (DMR) must document and agree the plan with the NSI.
- Materials and traceability: Requirements for materials, piece‑parts and added components include traceability to original manufacturer lot numbers; release for delivery requires conformity to the detail specification and traceability.
- Maintenance and withdrawal: Periodic design‑evaluation testing and continuous production requirements maintain qualification; procedures for failures and withdrawal follow QC 001002-3.
Applications and who uses it
- Hybrid IC manufacturers seeking formal manufacturing line certification and customer confidence.
- Quality assurance and reliability engineers implementing qualification programs and test schedules.
- OEMs and procurement teams specifying supplier qualification for critical hybrid assemblies.
- Test houses and NSIs conducting assessments and issuing IECQ qualification certificates.
Related standards
- IEC 60748-23-1 (generic specification and test methods)
- IEC 61340-5-1 (ESD protection)
- QC 001002-3 (IECQ rules of procedure for approval)
Keywords: IEC 60748-23-5, hybrid integrated circuits, manufacturing line certification, qualification approval, Q‑PALS, blank detail specification, semiconductor devices.
Open preview (PDF)Semiconductor devices - Integrated circuits, Part 23-5: Hybrid integrated circuits and film structures - Manufacturing line certification - Procedure for qualification approval
