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IEC 60749-2:2002 PDF

Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure

First page of standard IEC 60749-2:2002Open preview (PDF)Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
Title (English):
IEC 60749-2:2002

Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure

Document status:
Active
Format:
Electronic (PDF)
Number of pages:
11
Publication date:
April 12, 2002
Edition:
IEC IS 60749 edition 1 version 1
ICS:
31.080.01
Description (English):

Covers the testing of low air pressure on semiconductor devices. The test is intended primarily to determine the ability of component parts and materials to avoid voltage breakdown failures due to the reduced dielectric strength of air and other insulating materials at reduced pressures is only applicable to devices where the operating voltage exceeds 1 000 V. This test is applicable to all semiconductor devices provided they are in cavity type packages. The test is intended for military and space-related applications only. The contents of the corrigendum of August 2003 have been included in this copy.

Technical details

Technical committee
TC 47 - Semiconductor devices
SKU
IEC 60749-2:2002

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