IEC 60749-22:2002/COR1:2003 PDF

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Open preview (PDF)Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Title (English):

IEC 60749-22:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Format:

Electronic (PDF)

Number of pages:

10

Publication date:

August 13, 2003

Edition:

IEC IS 60749 edition 1 version 1

ICS:

31.080.01

Technical committee:

TC 47 - Semiconductor devices

Technical details

SKU

IEC 60749-22:2002/COR1:2003