IEC 60749-24:2025 PDF

Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST

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Title (English):

IEC 60749-24:2025

Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST

Document status:: Active
Format:: Electronic (PDF)
Number of pages:: 9
Publication date:: November 27, 2025
Edition:: IEC IS 60749 edition 2 version 1
ICS:: 31.080.01

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Description (English):

IEC 60749-24:2025 specifies unbiased highly accelerated stress testing (HAST). HAST is performed for the purpose of evaluating the reliability of non-hermetically packaged solid-state devices in humid environments. It is a highly accelerated test which employs temperature and humidity under non-condensing conditions to accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors which pass through it. Bias is not applied in this test to ensure that the failure mechanisms potentially overshadowed by bias can be uncovered (e.g. galvanic corrosion). This test is used to identify failure mechanisms internal to the package and is destructive. This edition includes the following significant technical changes with respect to the previous edition: a) rearrangement of clauses to reposition requirements; b) addition of two notes to the post-test electrical procedures.

Technical details

Technical committee: TC 47 - Semiconductor devices
SKU: IEC 60749-24:2025

Abstract

Overview

IEC 60749-24:2025 - "Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST" specifies an unbiased Highly Accelerated Stress Test (HAST) for evaluating the moisture sensitivity and reliability of non‑hermetically packaged semiconductor devices in humid, non‑condensing environments. This destructive, highly accelerated moisture resistance method uses elevated temperature and humidity (without electrical bias) to accelerate moisture penetration through encapsulants or along interfaces and to reveal failure mechanisms (for example, galvanic corrosion) that may be masked when bias is applied.

This second edition (2025) updates the 2004 edition, including clause reorganization and additions to post‑test electrical procedures.

Key topics and requirements

Test purpose: Accelerated moisture resistance evaluation of solid‑state devices in humid, non‑condensing conditions.
Unbiased HAST specifics: No electrical bias applied - used to uncover failure modes potentially obscured by bias.
Test conditions (examples from the standard):
- Condition A: 130 ± 2 °C, 85 ± 5 % RH (typical duration ~96 h)
- Condition B: 110 ± 2 °C, 85 ± 5 % RH (typical duration ~264 h)
- Non‑condensing environment and controlled vapor pressure; 85 °C/85 % RH cited as a less accelerated reference.
Apparatus and records: Chamber capable of holding temperature, RH and pressure; permanent temperature profile records and calibration to avoid condensation.
Device placement and mounting: DUTs positioned to minimize temperature gradients, ≥30 mm from chamber surfaces, avoid direct radiant heaters; boards oriented to avoid vapor circulation blockage.
Materials control: Use distilled/deionized water (≥1 MΩ·cm resistivity) and minimize ionic contamination to avoid spurious corrosion.
Safety and cautions: Moisture lowers polymer glass transition temperature (Tg); stress above effective Tg can create non‑representative failures - exercise caution when selecting temperatures.
Destructive test: Intended to reveal internal package failure mechanisms; post‑test electrical procedures included.

Applications and users

Reliability and qualification testing for semiconductor manufacturers, component suppliers, and independent test laboratories.
Used by reliability engineers, qualification teams, and OEMs designing components for electronics in humid or demanding environments (consumer, industrial, automotive, aerospace), where moisture ingress and internal corrosion are concerns.
Employed as an alternative or complement to unbiased autoclave testing to accelerate moisture‑related failures.

Related standards

IEC 60749-5 (steady‑state temperature humidity bias life test)
IEC 60749-33 (Accelerated moisture resistance - Unbiased autoclave)
JEDEC JESD22‑A118B.01 (basis for this IEC edition)

Keywords: IEC 60749-24:2025, Unbiased HAST, accelerated moisture resistance, semiconductor humidity testing, non-hermetic packages, reliability testing.

Related standards

Mentioned in the description and other IEC standards

Abstract

Overview

This second edition (2025) updates the 2004 edition, including clause reorganization and additions to post‑test electrical procedures.

Key topics and requirements

Test purpose: Accelerated moisture resistance evaluation of solid‑state devices in humid, non‑condensing conditions.
Unbiased HAST specifics: No electrical bias applied - used to uncover failure modes potentially obscured by bias.
Test conditions (examples from the standard):
- Condition A: 130 ± 2 °C, 85 ± 5 % RH (typical duration ~96 h)
- Condition B: 110 ± 2 °C, 85 ± 5 % RH (typical duration ~264 h)
- Non‑condensing environment and controlled vapor pressure; 85 °C/85 % RH cited as a less accelerated reference.
Apparatus and records: Chamber capable of holding temperature, RH and pressure; permanent temperature profile records and calibration to avoid condensation.
Device placement and mounting: DUTs positioned to minimize temperature gradients, ≥30 mm from chamber surfaces, avoid direct radiant heaters; boards oriented to avoid vapor circulation blockage.
Materials control: Use distilled/deionized water (≥1 MΩ·cm resistivity) and minimize ionic contamination to avoid spurious corrosion.
Safety and cautions: Moisture lowers polymer glass transition temperature (Tg); stress above effective Tg can create non‑representative failures - exercise caution when selecting temperatures.
Destructive test: Intended to reveal internal package failure mechanisms; post‑test electrical procedures included.

Applications and users

Reliability and qualification testing for semiconductor manufacturers, component suppliers, and independent test laboratories.
Used by reliability engineers, qualification teams, and OEMs designing components for electronics in humid or demanding environments (consumer, industrial, automotive, aerospace), where moisture ingress and internal corrosion are concerns.
Employed as an alternative or complement to unbiased autoclave testing to accelerate moisture‑related failures.

Related standards

IEC 60749-5 (steady‑state temperature humidity bias life test)
IEC 60749-33 (Accelerated moisture resistance - Unbiased autoclave)
JEDEC JESD22‑A118B.01 (basis for this IEC edition)

Keywords: IEC 60749-24:2025, Unbiased HAST, accelerated moisture resistance, semiconductor humidity testing, non-hermetic packages, reliability testing.

IEC 60749-24:2025 PDF

Technical details

Abstract

Overview

Key topics and requirements

Applications and users

Related standards

Related standards

Abstract

Overview

Key topics and requirements

Applications and users

Related standards

Related standards

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