IEC 60749-8:2002/COR1:2003 PDF

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

Open preview (PDF)Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

Title (English):

IEC 60749-8:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

Document status:

Active

Format:

Electronic (PDF)

Number of pages:

10

Publication date:

April 23, 2003

Edition:

IEC IS 60749 edition 1 version 1

ICS:

31.080.01

Technical details

Technical committee

TC 47 - Semiconductor devices

SKU

IEC 60749-8:2002/COR1:2003