IEC 61188-1-2:1998 PDF
Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
Open preview (PDF)Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedanceTitle (English):
IEC 61188-1-2:1998
Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
- Document status:
- Withdrawn
- Format:
- Electronic (PDF)
- Number of pages:
- 83
- Publication date:
- April 29, 1998
- Edition:
- IEC IS 61188 edition 1 version 1
- ICS:
- 31.180
Description (English):
The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.
Technical details
- Technical committee
- TC 91 - Electronics assembly technology
- SKU
- IEC 61188-1-2:1998
