IEC 61188-5-1:2002 PDF
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
Open preview (PDF)Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirementsTitle (English):
IEC 61188-5-1:2002
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
- Format:
- Electronic (PDF)
- Number of pages:
- 141
- Publication date:
- July 12, 2002
- Edition:
- IEC IS 61188 edition 1 version 1
- ICS:
- 01
- Technical committee:
- TC 91 - Electronics assembly technology
Description (English):
Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.
Technical details
- SKU
- IEC 61188-5-1:2002
