Overview
IEC 61189-2:2006 is an International Electrotechnical Commission (IEC) standard that catalogs test methods for materials used in interconnection structures, including printed boards (PCBs), laminates and related assembly materials. Part 2 of the IEC 61189 series provides standardized methodologies and procedures to evaluate chemical, mechanical, electrical and environmental properties of materials used in manufacturing interconnection structures.
Key topics
The standard groups test methods into clearly defined categories and includes guidance on measurement quality and reporting:
- Preparation/conditioning (P) - sample conditioning and pre-tests.
- Visual (V) and Dimensional (D) - thickness, rectangularity, dimensional stability.
- Chemical (C) - resin content, gel time of prepregs, volatile content, total halogen content, flammability (vertical/horizontal/flex), UV blocking and corrosion/blistering checks.
- Mechanical (M) - peel and pull-off strength, bow/twist, flexural and rolling fatigue, resin flow, glass transition (DSC/TMA), time-to-delamination.
- Electrical (E) - surface/volume resistivity, dielectric breakdown, comparative tracking index (CTI), permittivity/dissipation, arc resistance, insulation resistance.
- Environmental (N) - water absorption, pressure cooker / accelerated ageing (as applicable).
- Miscellaneous (X) - additional dimensional and process-related checks.
The document also addresses accuracy, precision, resolution and uncertainty limits, provides Student’s t distribution guidance, and contains informative annexes with worked examples, conversion tables and laboratory pro forma forms.
Practical applications
IEC 61189-2 is used to:
- Verify raw material compliance during PCB laminate and prepreg qualification.
- Establish supplier quality control and incoming inspection criteria for PCB materials procurement.
- Support failure analysis and reliability testing for electronics manufacturing and assemblies.
- Define laboratory test procedures for independent test houses and R&D teams validating new materials or process changes.
- Provide test method references in product specifications and regulatory submissions where material performance must be demonstrated.
Typical users: PCB manufacturers, laminate/prepreg suppliers, electronics OEMs, contract manufacturers, independent test labs, materials engineers and quality managers.
Related standards
- Part of the IEC 61189 series (test methods for electrical materials and printed boards).
- Complements other PCB/assembly standards that specify performance or safety requirements (refer to IEC catalogue for cross-references).
By standardizing test procedures such as peel strength, glass transition (Tg by DSC/TMA), flammability and resistivity, IEC 61189-2:2006 helps ensure consistent, reproducible evaluation of materials critical to reliable interconnection structures and printed circuit board manufacturing.
Open preview (PDF)Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
