IEC 61189-2-804:2023 PDF

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

First page of standard IEC 61189-2-804:2023

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Title (English):

IEC 61189-2-804:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

Document status:: Active
Format:: Electronic (PDF)
Number of pages:: 16
Publication date:: August 25, 2023
Edition:: IEC IS 61189 edition 1 version 1
ICS:: 31.180

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Description (English):

IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.

Technical details

Technical committee: TC 91 - Electronics assembly technology
SKU: IEC 61189-2-804:2023

Abstract

Overview

IEC 61189-2-804:2023 is an international standard published by the International Electrotechnical Commission (IEC) that specifies test methods for determining the time to delamination of electrical materials, printed boards, and other interconnection structures and assemblies. Utilizing a Thermomechanical Analyser (TMA), this standard focuses on evaluating the thermal durability of base materials and printed circuit board (PCB) laminates under elevated temperature conditions-typically at 260 °C, 288 °C, and 300 °C. However, it allows flexibility in temperature selection based on specific testing requirements.

This standard is crucial for manufacturers, designers, and quality control professionals engaged in electronics assembly and materials testing, offering a reliable method to assess material integrity under thermomechanical stress and to predict the lifespan and reliability of PCB laminates.

Key Topics

Test Method for Time to Delamination: Determination of the duration until the onset of delamination in PCB substrates or base materials when subjected to high-temperature conditions.
Specimen Preparation and Requirements: Samples consist of unclad laminate materials or printed circuit boards, preferably from multilayer boards with internal conductors intact to assess bond integrity. Specimens are typically 6.35 mm by 6.35 mm, with smooth edges achieved through sanding to prevent mechanical stress.
Equipment Specifications:
- Thermomechanical Analyser (TMA) with dimensional change detection of ±0.001 mm
- Drying chamber maintained at 105 °C ± 2 °C
- Low humidity cabinet (

Related standards

Other IEC standards

Overview

Key Topics

Test Method for Time to Delamination: Determination of the duration until the onset of delamination in PCB substrates or base materials when subjected to high-temperature conditions.
Specimen Preparation and Requirements: Samples consist of unclad laminate materials or printed circuit boards, preferably from multilayer boards with internal conductors intact to assess bond integrity. Specimens are typically 6.35 mm by 6.35 mm, with smooth edges achieved through sanding to prevent mechanical stress.
Equipment Specifications:
- Thermomechanical Analyser (TMA) with dimensional change detection of ±0.001 mm
- Drying chamber maintained at 105 °C ± 2 °C
- Low humidity cabinet (

IEC 61189-2-804:2023 PDF

Technical details

Abstract

Overview

Key Topics

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Abstract

Overview

Key Topics

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