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IEC 61189-3-913:2016 PDF

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs

First page of standard IEC 61189-3-913:2016Open preview (PDF)Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs
Title (English):
IEC 61189-3-913:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs

Document status:
Active
Format:
Electronic (PDF)
Number of pages:
6
Publication date:
January 5, 2016
Edition:
IEC IS 61189 edition 1 version 1
ICS:
29.060.10
Description (English):

IEC 61189-3-913:2016 specifies the test methods for thermal conductivity specific to printed circuit boards for high-brightness LEDs. The test applies to printed circuit boards for high-brightness LEDs with surface mounted LEDs or with device embedded LEDs in electronic control devices (ECDs). This first edition cancels and replaces the first edition of IEC PAS 61189-3-913 published in 2011. This edition constitutes a technical revision. This edition focused only on the test methods for thermal conductivity specific to printed circuit boards for high-brightness LEDs.

Technical details

Technical committee
TC 91 - Electronics assembly technology
SKU
IEC 61189-3-913:2016

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