IEC 61189-5:2006 PDF

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

Open preview (PDF)Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

Title (English):

IEC 61189-5:2006

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

Document status:

Withdrawn

Format:

Electronic (PDF)

Number of pages:

62

Publication date:

August 29, 2006

Edition:

IEC IS 61189 edition 1 version 1

ICS:

31.180

Description (English):

IEC 61189-5:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.

Technical details

Technical committee

TC 91 - Electronics assembly technology

SKU

IEC 61189-5:2006