Overview
IEC 61190-1-3:2017 is an international standard published by the International Electrotechnical Commission (IEC), which specifies the requirements and test methods for electronic grade solder alloys used in electronic soldering applications. This standard covers both fluxed and non-fluxed solid solders, including bars, ribbons, powders, and solder pastes. Its primary objective is to serve as a quality control guideline rather than directly addressing solder performance during manufacturing.
The 2017 edition features significant updates such as revised maximum impurity levels for lead (Pb) and the inclusion of additional lead-free solder alloys, making it more relevant to current environmental and health regulations.
Key Topics
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Classification of solder materials:
IEC 61190-1-3 defines classifications based on alloy composition, solder form, flux type and content, and other key characteristics for quality assurance.
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Materials and Alloys:
The standard specifies quality requirements for various solder alloys, including lead-containing and lead-free options compliant with environmental standards. It details the characteristics of bar, wire, ribbon, and powder solder forms.
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Flux Types and Content:
Flux is critical in soldering to enhance solderability. This standard covers fluxed solders with varying flux percentages as well as non-fluxed solid solders.
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Quality Assurance Processes:
Detailed provisions for inspection, sampling, and testing routines ensure materials meet defined purity and consistency criteria. This includes requirements for test equipment, inspection conditions, and handling rejected lots.
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Marking and Labelling:
Clear specifications for labelling solders and soldered assemblies facilitate traceability and quality control in electronic manufacturing processes.
Applications
IEC 61190-1-3:2017 is essential for manufacturers, quality control professionals, and suppliers involved in electronic assembly and soldering processes. Its application ensures:
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Consistent quality of solder alloys:
Minimizing defects related to solder material inconsistencies such as voids, weak joints, and flux residues.
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Compliance with environmental and safety regulations:
Incorporating updated classifications with restricted lead content and lead-free alternatives supports RoHS compliance and safer manufacturing environments.
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Process reliability in electronic manufacturing:
By adhering to prescribed alloy compositions and flux requirements, manufacturers can optimize solder joint performance and long-term reliability of electronic devices.
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Standardized communication:
Clear definitions, marking methods, and classification systems assist in international trade and reduce confusion between suppliers and customers.
Related Standards
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ISO 9453:
Provides generic specifications for solder alloys and fluxes referenced by IEC 61190-1-3.
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IEC 61190 series:
Other parts of this series address attachment materials for electronic assembly, each focusing on distinct material types or soldering applications.
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IEC 60068:
Environmental testing standards that complement IEC 61190-1-3 by assessing the durability of materials under environmental stresses.
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RoHS Directive and related environmental standards:
While not part of IEC publications, compliance with lead content restrictions in solder alloys aligns with IEC 61190-1-3’s updated impurity limits.
By following IEC 61190-1-3:2017, electronics manufacturers and suppliers can ensure high-quality solder materials tailored for robust, environmentally compliant, and efficient electronic assembly operations. This standard is a cornerstone for achieving reliable solder joints that meet modern industrial demands and regulatory frameworks.
Open preview (PDF)Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
