IEC 61191-1:2018 PDF

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

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Title (English):

IEC 61191-1:2018

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Document status:: Active
Format:: Electronic (PDF)
Number of pages:: 140
Publication date:: September 14, 2018
Edition:: IEC IS 61191 edition 3 version 1
ICS:: 01.040.11

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Description (English):

IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition: - the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F; - the term "assembly drawing" has been changed to "assembly documentation" throughout; - references to IEC standards have been corrected; - Clause 9 was completely rewritten; - Annex B was removed because there are already procedures for circuit board assemblies.

Technical details

Technical committee: TC 91 - Electronics assembly technology
SKU: IEC 61191-1:2018

Abstract

Overview

IEC 61191-1:2018 - Printed board assemblies - Part 1: Generic specification - defines generic requirements for producing quality soldered electrical and electronic assemblies using surface mount and related assembly technologies. The standard prescribes requirements for materials, methods and verification criteria and includes recommendations for good manufacturing practice. The 2018 edition aligns acceptance criteria with IPC‑A‑610F, updates terminology (from “assembly drawing” to assembly documentation), corrects IEC references, rewrites Clause 9 (cleanliness/residues) and removes Annex B.

Key topics and technical requirements

Materials and compatibility: requirements for solder, flux, solder paste, adhesives, cleaning agents and polymeric coatings.
Component and board requirements: solderability, solderability maintenance, preconditioning and lead preparation.
Assembly processes: process control for reflow soldering, manual soldering, mechanized immersion and related heat application methods.
Process control and documentation: requirements flowdown, conformance documentation, visual aids and assembly documentation to ensure consistent manufacturing.
Cleanliness and residues: rewritten Clause 9 addresses pre/post-solder cleaning, verification, ionic/non‑ionic residues, SIR considerations and cleanliness verification methods.
Inspection and acceptance: acceptance criteria and process control limits (now consistent with IPC‑A‑610F), defect classification and corrective action limits.
Facilities and personnel: ESD control, environmental conditions (temperature, humidity, lighting), cleanrooms and proficiency of personnel for design and manufacturing.
Equipment and process development: machine maintenance, process development for reflow and immersion soldering, thermal dissipation and handling.

Practical applications and users

IEC 61191-1:2018 is intended for organizations that design, assemble, inspect or procure printed board assemblies:

Contract manufacturers (CMs) and original equipment manufacturers (OEMs) for establishing process controls and acceptance criteria.
Process engineers and production managers implementing reliable reflow and soldering processes.
Quality assurance and inspection teams using standardized acceptance and cleanliness criteria.
Purchasing and compliance teams specifying assembly documentation and materials. The standard helps reduce assembly defects, ensure solder joint reliability, and harmonize acceptance criteria across global supply chains.

Related standards

IPC‑A‑610F - Acceptance criteria for electronic assemblies (IEC 61191-1:2018 updated to be compliant).
Other IEC standards referenced within IEC 61191-1 for specific test methods and materials compatibility.

Keywords: IEC 61191-1:2018, printed board assemblies, surface mount, soldered assemblies, reflow soldering, solderability, cleanliness, IPC‑A‑610F.

Related standards

Other IEC standards

Abstract

Overview

Key topics and technical requirements

Materials and compatibility: requirements for solder, flux, solder paste, adhesives, cleaning agents and polymeric coatings.
Component and board requirements: solderability, solderability maintenance, preconditioning and lead preparation.
Assembly processes: process control for reflow soldering, manual soldering, mechanized immersion and related heat application methods.
Process control and documentation: requirements flowdown, conformance documentation, visual aids and assembly documentation to ensure consistent manufacturing.
Cleanliness and residues: rewritten Clause 9 addresses pre/post-solder cleaning, verification, ionic/non‑ionic residues, SIR considerations and cleanliness verification methods.
Inspection and acceptance: acceptance criteria and process control limits (now consistent with IPC‑A‑610F), defect classification and corrective action limits.
Facilities and personnel: ESD control, environmental conditions (temperature, humidity, lighting), cleanrooms and proficiency of personnel for design and manufacturing.
Equipment and process development: machine maintenance, process development for reflow and immersion soldering, thermal dissipation and handling.

Practical applications and users

IEC 61191-1:2018 is intended for organizations that design, assemble, inspect or procure printed board assemblies:

Contract manufacturers (CMs) and original equipment manufacturers (OEMs) for establishing process controls and acceptance criteria.
Process engineers and production managers implementing reliable reflow and soldering processes.
Quality assurance and inspection teams using standardized acceptance and cleanliness criteria.
Purchasing and compliance teams specifying assembly documentation and materials. The standard helps reduce assembly defects, ensure solder joint reliability, and harmonize acceptance criteria across global supply chains.

Related standards

IPC‑A‑610F - Acceptance criteria for electronic assemblies (IEC 61191-1:2018 updated to be compliant).
Other IEC standards referenced within IEC 61191-1 for specific test methods and materials compatibility.

Keywords: IEC 61191-1:2018, printed board assemblies, surface mount, soldered assemblies, reflow soldering, solderability, cleanliness, IPC‑A‑610F.

IEC 61191-1:2018 PDF

Technical details

Abstract

Overview

Key topics and technical requirements

Practical applications and users

Related standards

Related standards

Abstract

Overview

Key topics and technical requirements

Practical applications and users

Related standards

Related standards

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