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IEC 61192-1:2003 PDF

Workmanship requirements for soldered electronic assemblies - Part 1: General

First page of standard IEC 61192-1:2003Open preview (PDF)Workmanship requirements for soldered electronic assemblies - Part 1: General
Title (English):
IEC 61192-1:2003

Workmanship requirements for soldered electronic assemblies - Part 1: General

Document status:
Withdrawn
Format:
Electronic (PDF)
Number of pages:
147
Publication date:
February 20, 2003
Edition:
IEC IS 61192 edition 1 version 1
ICS:
31.190
Description (English):

Specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates. Defines requirements and guidelines for good workmanship and practice in the preparation, soldering, inspection and testing of electronic and electrical assemblies. Enables achievement of high yields and high product quality through process control in production.

Technical details

Technical committee
TC 91 - Electronics assembly technology
SKU
IEC 61192-1:2003

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