IEC 61192-2:2003 PDF
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
Open preview (PDF)Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assembliesTitle (English):
IEC 61192-2:2003
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
- Document status:
- Withdrawn
- Format:
- Electronic (PDF)
- Number of pages:
- 127
- Publication date:
- March 14, 2003
- Edition:
- IEC IS 61192 edition 1 version 1
- ICS:
- 31.190
Description (English):
Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.
Technical details
- Technical committee
- TC 91 - Electronics assembly technology
- SKU
- IEC 61192-2:2003
