IEC 61192-3:2002 PDF
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
Open preview (PDF)Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assembliesTitle (English):
IEC 61192-3:2002
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
- Document status:
- Withdrawn
- Format:
- Electronic (PDF)
- Number of pages:
- 93
- Publication date:
- December 17, 2002
- Edition:
- IEC IS 61192 edition 1 version 1
- ICS:
- 31.190
Description (English):
Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.
Technical details
- Technical committee
- TC 91 - Electronics assembly technology
- SKU
- IEC 61192-3:2002
