IEC 61192-4:2002 PDF
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
Open preview (PDF)Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assembliesTitle (English):
IEC 61192-4:2002
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
- Document status:
- Withdrawn
- Format:
- Electronic (PDF)
- Number of pages:
- 59
- Publication date:
- November 29, 2002
- Edition:
- IEC IS 61192 edition 1 version 1
- ICS:
- 31.190
Description (English):
Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.
Technical details
- Technical committee
- TC 91 - Electronics assembly technology
- SKU
- IEC 61192-4:2002
