IEC 61192-5:2007 PDF
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
Open preview (PDF)Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assembliesWorkmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
- Document status:
- Withdrawn
- Format:
- Electronic (PDF)
- Number of pages:
- 38
- Publication date:
- May 23, 2007
- Edition:
- IEC IS 61192 edition 1 version 1
- ICS:
- 31.190
IEC 61192-5:2007 provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies. It is applicable to specific processes used to manufacture soldered electronic assemblies where components are attached to printed boards and to the relevant parts of resulting products. The standard is also applicable to activities that can form part of the work in assembling mixed technology products. It also contains guidance on design matters where they have relevance to rework.
Technical details
- Technical committee
- TC 91 - Electronics assembly technology
- SKU
- IEC 61192-5:2007
