IEC 61240:2016 PDF

Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules

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Title (English):

IEC 61240:2016

Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules

Document status:: Active
Format:: Electronic (PDF)
Number of pages:: 18
Publication date:: October 24, 2016
Edition:: IEC IS 61240 edition 3 version 1
ICS:: 31.140

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Description (English):

IEC 61240:2016 sets out general rules for drawing all dimensional and geometrical characteristics of a surface-mounted piezoelectric device package (referred to in this document as SMD) in order to ensure mechanical inter-changeability of all outline drawings of the SMDs for frequency control and selection. This edition includes the following significant technical changes with respect to the previous edition: - outline drawings have been changed from three views (top, front and bottom) to that based on ISO layout in the third-angle projection, in which the view from the right has been added to the top, front and bottom views; - reference line and geometrical dimensions of the package for enclosures have been changed for practical use; - information on miniaturized leadless ceramic enclosures of piezoelectric devices (SMD) for frequency control and selection has been included in an annex.

Technical details

Technical committee: TC 49 - Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection
SKU: IEC 61240:2016

Abstract

Overview

IEC 61240:2016 - Piezoelectric devices: Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules defines the general rules for preparing dimensional and geometrical outline drawings of surface-mounted piezoelectric device packages. Its purpose is to ensure mechanical interchangeability of SMD outline drawings used for frequency control and frequency selection components such as quartz crystal resonators and oscillators. The 2016 (3rd) edition introduced key changes including adoption of the ISO layout in third-angle projection (adding the right-side view), revised reference lines and package geometry conventions, and an annex covering miniaturized leadless ceramic enclosures.

Key topics and technical requirements

Scope and classification: Defines SMD package types - leaded, folded-leads, and leadless - based on terminal lead structure.
Outline drawing composition: Requires four-view drawings (top, front, right, bottom in third-angle projection), a table of detailed dimensions (mm), an actual-size sketch, terminal land area drawings, and terminal lead details.
Projection and tolerancing: Drawings follow the ISO third-angle projection; projected tolerance zones reference ISO 1101 for geometrical tolerancing.
Terminal lead and spacing rules:
- Center positions and spacing of terminal leads must be shown; basic pitch e = 2.54 × n mm, and 1.27 × n mm for packages smaller than 6 mm.
- Terminal numbering convention and identification (terminal 1 marking) are specified.
Terminal land area and PCB interface: Land area dimensions are specified relative to the device contact centerline and define maximum areas to be added to projection zones for PCB mounting.
Annex on miniaturized leadless ceramic enclosures: Adds guidance for very small leadless packages, including drawing scale, dimension tables, and naming rules.
Normative references: Cross-references ISO/IEC directives and IEC 60191-6 (outline drawing rules for SMD semiconductor packages).

Practical applications and users

IEC 61240:2016 is used by:

Component manufacturers preparing catalog outline drawings and package specifications for piezoelectric resonators/oscillators.
PCB designers and layout engineers creating land patterns and footprint libraries for frequency-control devices.
Mechanical and test engineers ensuring interchangeability and assembly fit across suppliers.
Procurement and product managers evaluating supplier datasheets for compatibility.
Standards committees and documentation teams harmonizing enclosure layouts and package naming.

Practical benefits include reliable cross-supplier compatibility, reduced redesign risk, simplified supplier substitution, and consistent footprint documentation for surface-mounted frequency-control components.

Related standards

IEC 60191-6 - General rules for preparation of outline drawings of surface-mounted semiconductor device packages.
ISO 1101 - Referenced for projected tolerance zones used in outline drawings.

Keywords: IEC 61240:2016, piezoelectric devices, surface-mounted devices (SMD), outline drawings, frequency control, mechanical interchangeability, third-angle projection, terminal land area, leadless ceramic enclosures.

Related standards

Mentioned in the description and other IEC standards

Abstract

Overview

Key topics and technical requirements

Scope and classification: Defines SMD package types - leaded, folded-leads, and leadless - based on terminal lead structure.
Outline drawing composition: Requires four-view drawings (top, front, right, bottom in third-angle projection), a table of detailed dimensions (mm), an actual-size sketch, terminal land area drawings, and terminal lead details.
Projection and tolerancing: Drawings follow the ISO third-angle projection; projected tolerance zones reference ISO 1101 for geometrical tolerancing.
Terminal lead and spacing rules:
- Center positions and spacing of terminal leads must be shown; basic pitch e = 2.54 × n mm, and 1.27 × n mm for packages smaller than 6 mm.
- Terminal numbering convention and identification (terminal 1 marking) are specified.
Terminal land area and PCB interface: Land area dimensions are specified relative to the device contact centerline and define maximum areas to be added to projection zones for PCB mounting.
Annex on miniaturized leadless ceramic enclosures: Adds guidance for very small leadless packages, including drawing scale, dimension tables, and naming rules.
Normative references: Cross-references ISO/IEC directives and IEC 60191-6 (outline drawing rules for SMD semiconductor packages).

Practical applications and users

IEC 61240:2016 is used by:

Component manufacturers preparing catalog outline drawings and package specifications for piezoelectric resonators/oscillators.
PCB designers and layout engineers creating land patterns and footprint libraries for frequency-control devices.
Mechanical and test engineers ensuring interchangeability and assembly fit across suppliers.
Procurement and product managers evaluating supplier datasheets for compatibility.
Standards committees and documentation teams harmonizing enclosure layouts and package naming.

Related standards

IEC 60191-6 - General rules for preparation of outline drawings of surface-mounted semiconductor device packages.
ISO 1101 - Referenced for projected tolerance zones used in outline drawings.

IEC 61240:2016 PDF

Technical details

Abstract

Overview

Key topics and technical requirements

Practical applications and users

Related standards

Related standards

Abstract

Overview

Key topics and technical requirements

Practical applications and users

Related standards

Related standards

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