Overview
IEC 61249-2-23:2005 is an international standard published by the International Electrotechnical Commission (IEC) that specifies requirements for reinforced base materials used in printed boards and other interconnecting structures. This part focuses on non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad, available in thicknesses ranging from 0.8 mm up to 3.2 mm. The standard establishes essential specifications related to the materials' electrical and non-electrical properties, construction, testing, and quality assurance to ensure reliability in manufacturing and end-use applications.
This standard is crucial for manufacturers, engineers, and quality managers involved in the production and application of printed circuit boards (PCBs), especially those requiring cost-effective yet functional copper-clad laminates with controlled flammability and mechanical characteristics.
Key Topics
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Material Composition and Construction
The standard defines materials made from phenolic cellulose paper reinforced laminated sheets that are non-halogenated. These laminates are copper-clad to provide electrical conductivity and are designed for economical production without sacrificing basic electrical and mechanical performance.
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Grades and Flammability Requirements
Two main material grades are specified:
- Material 61249-2-23-1: General-purpose grade with unspecified flammability.
- Material 61249-2-23-2: Materials meeting defined flammability criteria verified by vertical burning tests, categorized as FV0 or FV1 according to Table 8.
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Electrical and Mechanical Properties
The document sets detailed characteristics including electrical insulation performance, flexural strength, water absorption, and dimensional stability essential for PCB reliability.
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Physical and Thermal Properties
Properties such as thickness accuracy, bow and twist limits, glass transition temperature, and moisture resistance are outlined for manufacturing consistency.
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Copper Foil Bond and Surface Quality
Adhesion between the copper foil and the laminated base, surface appearance on both copper-clad and unclad faces, and suitability for machining and punching are standardized for process compatibility.
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Quality Assurance and Testing
The standard includes comprehensive quality management protocols, including qualification inspection, conformity checks, certification, and safety data requirements to support traceability and compliance.
Applications
IEC 61249-2-23:2005 materials are widely used in the manufacture of printed circuit boards where economic, reliable, and environmentally conscious base materials are needed. Typical applications include:
- Consumer Electronics: Devices requiring cost-effective PCBs with stable electrical properties.
- Industrial Equipment: Control systems and machinery that require durable, flame-retardant base materials.
- Lighting and Automotive: Interconnection substrates that benefit from non-halogenated, flame-resistant materials.
- PCB Prototyping and Small-volume Production: Where variability in flammability criteria and cost efficiency are key.
These materials support printed boards utilized in environments imposing moderate mechanical and thermal demands, providing a balance between performance and affordability.
Related Standards
For comprehensive design and manufacturing of printed boards and interconnecting structures, IEC 61249-2-23:2005 interacts with related standards such as:
- IEC 61249 Series: Covers other reinforced base materials and laminated sheets made from different resin and reinforcement combinations.
- IEC 60034 Series: For general standard numbering and documentation by the IEC.
- IPC Standards: Specifications covering printed circuit board design, manufacturing, and quality testing complementing IEC requirements.
- UL Flammability Standards: For additional flammability classification and testing often referenced for materials in North America.
These related standards ensure that material selection, testing, and product design meet global industry requirements for safety, reliability, and performance.
By adhering to IEC 61249-2-23:2005, manufacturers and designers can ensure that the selected non-halogenated phenolic cellulose paper copper-clad laminated sheets meet internationally recognized benchmarks for high-quality printed circuit board substrates, supporting a range of economically optimized electronic applications.
Open preview (PDF)Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
