IEC 61249-3-3:1999 PDF

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film

First page of standard IEC 61249-3-3:1999

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Title (English):

IEC 61249-3-3:1999

Document status:: Active
Format:: Electronic (PDF)
Number of pages:: 13
Publication date:: February 10, 1999
Edition:: IEC IS 61249 edition 1 version 1
ICS:: 31.180

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Description (English):

Gives requirements for flexible polyester (PETP) films coated on one side or both with polyester, acrylic or epoxide type adhesive for use in the fabrication of flexible printed wring. Films coated on only one side are used as a coverlay or covercoat in the fabrication of flexible printed wiring. This coverlay or covercoat is also used to provide local support to areas subjected to mechanical or environmental stress. Films coated on both sides are used as bonding films in the fabrication of printed boards.

Technical details

Technical committee: TC 91 - Electronics assembly technology
SKU: IEC 61249-3-3:1999

Abstract

Overview

IEC 61249-3-3:1999 defines requirements for adhesive coated flexible polyester film (PETP) used in the manufacture of flexible printed wiring and flexible printed boards. It covers one-sided (coverlay/covercoat) and two-sided (bonding film) adhesive-coated polyester films, specifying material construction, thickness ranges, adhesive types, required properties after curing, and packaging/marking rules. The standard is intended for material suppliers, PCB fabricators and testing labs involved in flexible printed circuit (FPC) production.

Key Topics and Technical Requirements

Material composition: Flexible polyester (PETP) film coated with B‑staged adhesives of polyester, acrylic or epoxide type.
Film thickness (without adhesive): Preferred nominal values and maximum permitted tolerances-examples include 25 µm (±20%), 50 µm (±15%), 75–125 µm (±10%).
Adhesive thickness: Defined as the difference between coated and uncoated thickness; typical adhesive thickness range 12.5 µm to 75 µm with ±20% tolerance. Preferred adhesive thicknesses: 20, 25, 38, 50, 75 µm.
Designation: Standardized code format (example) - PET-IEC-61249-3-3-A-25-50-0-FV1, indicating film type, adhesive type (A/E/P), adhesive and film thicknesses and flammability rating.
Electrical properties after curing (selected values from IEC 61189-2 tests):
- Surface resistance: ≥ 2×10^12 Ω (min) in humidity chamber (optional)
- Volume resistivity: ≥ 2×10^4 Ω·m (min)
- Relative permittivity (after damp heat): ≤ 4.5
- Dielectric dissipation factor: ≤ 0.05
- Electrical strength: ≥ 60 kV/mm
Copper foil bond & mechanical:
- Peel strength: ≥ 0.7 N/mm as received; ≥ 0.6 N/mm after 10 s thermal shock
- No blistering or delamination after thermal shock
Dimensional stability (coverlays): Limits on shrinkage due to peeling or heating (e.g., ≤ 2.5 µm/mm for peeling).
Packaging/marking: Rolls only (standard lengths 50/75/100 m), core ID ≥ 75 mm, limited splices, and mandatory roll labeling (manufacturer, material ID, thicknesses, batch, date, etc.).
Normative references: IEC 60249-1 (test methods), IEC 61189-2 (test methods for interconnection materials).

Applications and Who Uses It

Flexible printed circuit (FPC) manufacturers selecting coverlays or bonding films for multilayer flex and rigid-flex PCBs.
Material suppliers specifying PETP film product data sheets and compliance claims.
PCB fabricators applying lamination and bonding processes, ensuring adhesive flow and bond strength.
Test laboratories and QA teams verifying electrical, mechanical and dimensional properties per IEC 61189-2 referenced methods.
Sectors: consumer electronics, automotive electronics, medical devices and other industries using flexible interconnects.

Related Standards

IEC 60249-1 - Base materials test methods
IEC 61189-2 - Test methods for materials for interconnection structures

Keywords: IEC 61249-3-3, adhesive coated polyester film, PETP, coverlay, bonding film, flexible printed boards, peel strength, electrical strength, lamination, flexible PCB materials.

Related standards

Mentioned in the description and other IEC standards

Abstract

Overview

Key Topics and Technical Requirements

Material composition: Flexible polyester (PETP) film coated with B‑staged adhesives of polyester, acrylic or epoxide type.
Film thickness (without adhesive): Preferred nominal values and maximum permitted tolerances-examples include 25 µm (±20%), 50 µm (±15%), 75–125 µm (±10%).
Adhesive thickness: Defined as the difference between coated and uncoated thickness; typical adhesive thickness range 12.5 µm to 75 µm with ±20% tolerance. Preferred adhesive thicknesses: 20, 25, 38, 50, 75 µm.
Designation: Standardized code format (example) - PET-IEC-61249-3-3-A-25-50-0-FV1, indicating film type, adhesive type (A/E/P), adhesive and film thicknesses and flammability rating.
Electrical properties after curing (selected values from IEC 61189-2 tests):
- Surface resistance: ≥ 2×10^12 Ω (min) in humidity chamber (optional)
- Volume resistivity: ≥ 2×10^4 Ω·m (min)
- Relative permittivity (after damp heat): ≤ 4.5
- Dielectric dissipation factor: ≤ 0.05
- Electrical strength: ≥ 60 kV/mm
Copper foil bond & mechanical:
- Peel strength: ≥ 0.7 N/mm as received; ≥ 0.6 N/mm after 10 s thermal shock
- No blistering or delamination after thermal shock
Dimensional stability (coverlays): Limits on shrinkage due to peeling or heating (e.g., ≤ 2.5 µm/mm for peeling).
Packaging/marking: Rolls only (standard lengths 50/75/100 m), core ID ≥ 75 mm, limited splices, and mandatory roll labeling (manufacturer, material ID, thicknesses, batch, date, etc.).
Normative references: IEC 60249-1 (test methods), IEC 61189-2 (test methods for interconnection materials).

Applications and Who Uses It

Flexible printed circuit (FPC) manufacturers selecting coverlays or bonding films for multilayer flex and rigid-flex PCBs.
Material suppliers specifying PETP film product data sheets and compliance claims.
PCB fabricators applying lamination and bonding processes, ensuring adhesive flow and bond strength.
Test laboratories and QA teams verifying electrical, mechanical and dimensional properties per IEC 61189-2 referenced methods.
Sectors: consumer electronics, automotive electronics, medical devices and other industries using flexible interconnects.

Related Standards

IEC 60249-1 - Base materials test methods
IEC 61189-2 - Test methods for materials for interconnection structures

Keywords: IEC 61249-3-3, adhesive coated polyester film, PETP, coverlay, bonding film, flexible printed boards, peel strength, electrical strength, lamination, flexible PCB materials.

IEC 61249-3-3:1999 PDF

Technical details

Abstract

Overview

Key Topics and Technical Requirements

Applications and Who Uses It

Related Standards

Related standards

Abstract

Overview

Key Topics and Technical Requirements

Applications and Who Uses It

Related Standards

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