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IEC 62769-6:2023 PDF

Field Device Integration (FDI®) - Part 6: FDI Technology Mappings

First page of standard IEC 62769-6:2023Open preview (PDF)Field Device Integration (FDI®) - Part 6: FDI Technology Mappings
Title (English):
IEC 62769-6:2023

Field Device Integration (FDI®) - Part 6: FDI Technology Mappings

Document status:
Active
Format:
Electronic (PDF)
Number of pages:
42
Publication date:
April 6, 2023
Edition:
IEC IS 62769 edition 3 version 1
ICS:
25.040.40
Description (English):

IEC 62769-6:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation of the components FDI® Client and User Interface Plug-in (UIP) in the specified technologies for the WORKSTATION platform and the MOBILE platform as defined in IEC 62769-4. There are individual subparts for the currently supported technologies .NET and HTML5.

Technical details

Technical committee
SC 65E - Devices and integration in enterprise systems
SKU
IEC 62769-6:2023

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