IEC 62899-202-7:2021 PDF

Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method

First page of standard IEC 62899-202-7:2021

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Title (English):

IEC 62899-202-7:2021

Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method

Document status:: Active
Format:: Electronic (PDF)
Number of pages:: 12
Publication date:: March 3, 2021
Edition:: IEC IS 62899 edition 1 version 1
ICS:: 29.035.01

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Description (English):

IEC 62899-202-7:2021(E) provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.

Technical details

Technical committee: TC 119 - Printed Electronics
SKU: IEC 62899-202-7:2021

Abstract

Overview

IEC 62899-202-7:2021 defines a quantitative test method for measuring the peel strength of a printed layer on a flexible substrate using the 90° peel method. Unlike conventional peel tests that require electroplating to thicken the printed layer for gripping, this standard peels the flexible substrate itself - a useful approach for porous or thin printed films (conductive inks) where electroplating can contaminate the interface. The procedure enables reliable comparison of adhesion for layers printed on the same substrate under defined thickness and environmental conditions.

Key topics and technical requirements

Scope: Measures adhesion between a printed conductive layer and flexible substrate when that interface is the weakest in the test stack.
Test geometry: 90° peel configuration with the substrate bent to 90° while the panel moves horizontally and the peeled portion is pulled vertically.
Sample dimensions (examples):
- Test panel ~50 mm × 120 mm
- Printed layer width: 10 mm ± 0.2 mm; length: 100 mm
- Substrate thickness range giving stable data: 25 µm to 125 µm
Standard atmospheric conditions: temperature (23 ± 2) °C and relative humidity (50 ± 5) %.
Apparatus: 90° peel tester with linear test length ≥ 50 mm; load cell range typically 20 N–100 N; displacement and load sensors to record peeling curves.
Data analysis: Peel strength is calculated as the average peel load divided by sample width, using steady-state load values after initial transient. Results and measurement parameters must be reported per the standard.
Applicability constraint: This method is usable only if F(sub-layer)

Related standards

Other IEC standards

Overview

Key topics and technical requirements

Scope: Measures adhesion between a printed conductive layer and flexible substrate when that interface is the weakest in the test stack.
Test geometry: 90° peel configuration with the substrate bent to 90° while the panel moves horizontally and the peeled portion is pulled vertically.
Sample dimensions (examples):
- Test panel ~50 mm × 120 mm
- Printed layer width: 10 mm ± 0.2 mm; length: 100 mm
- Substrate thickness range giving stable data: 25 µm to 125 µm
Standard atmospheric conditions: temperature (23 ± 2) °C and relative humidity (50 ± 5) %.
Apparatus: 90° peel tester with linear test length ≥ 50 mm; load cell range typically 20 N–100 N; displacement and load sensors to record peeling curves.
Data analysis: Peel strength is calculated as the average peel load divided by sample width, using steady-state load values after initial transient. Results and measurement parameters must be reported per the standard.
Applicability constraint: This method is usable only if F(sub-layer)

IEC 62899-202-7:2021 PDF

Technical details

Abstract

Overview

Key topics and technical requirements

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Abstract

Overview

Key topics and technical requirements

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