IEC 62899-202-8:2024 PDF

Printed electronics - Part 202-8: Materials - Conductive ink - Measurement of difference in resistance of printing direction of conductive film fabricated with wire-shaped materials

First page of standard IEC 62899-202-8:2024

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Title (English):

IEC 62899-202-8:2024

Printed electronics - Part 202-8: Materials - Conductive ink - Measurement of difference in resistance of printing direction of conductive film fabricated with wire-shaped materials

Document status:: Active
Format:: Electronic (PDF)
Number of pages:: 13
Publication date:: March 15, 2024
Edition:: IEC IS 62899 edition 1 version 1
ICS:: 31.180

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Description (English):

IEC 62899-202-8:2024 provides a method for measuring the resistance difference of the printing direction of a printed conductive layer with wire-shaped or wire-type conducting materials. The method described in this document offers a measurement method and conditions for solution processed conductive films, fabricated by coating and printing process.

Technical details

Technical committee: TC 119 - Printed Electronics
SKU: IEC 62899-202-8:2024

Abstract

Overview

IEC 62899-202-8:2024 is an IEC international standard in the Printed Electronics series that specifies a method to measure the difference in electrical resistance with respect to printing direction for conductive films made from wire-shaped (high aspect‑ratio) conducting materials. It covers solution-processed conductive films fabricated by coating and printing processes and is intended to quantify resistance anisotropy that arises from alignment of wire-shaped materials (e.g., metal nanowires) during printing.

Key topics and technical requirements

Scope: Measurement of resistance difference by printing direction for wire-shaped/wire-type conductive materials in printed conductive films.
Measurement environment: Tests are carried out at 23 °C ± 1 °C and relative humidity 50 % ± 5 %, with atmospheric pressure per ISO 291.
Measurement method: Four‑wire (Kelvin) resistance measurement is required to minimise lead/contact errors.
Resistance ranges and applied currents: The standard references resistance ranges mapped to test currents (examples include 1 A for

Related standards

Mentioned in the description and other IEC standards

Overview

Key topics and technical requirements

Scope: Measurement of resistance difference by printing direction for wire-shaped/wire-type conductive materials in printed conductive films.
Measurement environment: Tests are carried out at 23 °C ± 1 °C and relative humidity 50 % ± 5 %, with atmospheric pressure per ISO 291.
Measurement method: Four‑wire (Kelvin) resistance measurement is required to minimise lead/contact errors.
Resistance ranges and applied currents: The standard references resistance ranges mapped to test currents (examples include 1 A for

IEC 62899-202-8:2024 PDF

Technical details

Abstract

Overview

Key topics and technical requirements

Related standards

Abstract

Overview

Key topics and technical requirements

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