IEC 62899-402-1:2025 - Overview
IEC 62899-402-1:2025 is an international standard from the IEC that defines measurement methods for line pattern widths and spaces in printed electronics. It treats printed line patterns as two-dimensional features on a substrate and specifies how to acquire, process and report width and space data used for printability assessment and quality control. Three‑dimensional effects (vertical variance) are handled in separate measurement methods.
This edition (2025) updates terminology (from “pattern width” to line pattern width), adds a defined method for line pattern space measurement, and removes inner/outer edge line definitions.
Key topics and technical requirements
- Scope: Measurement of width of line patterns and spaces between adjacent lines in printed electronics; excludes 3D vertical measurements.
- Measuring instruments: Instruments must capture images that preserve per‑pixel information; image files must include pixel size metadata.
- Accuracy & repeatability: Instrument repeatability and accuracy should be less than 10% of the tolerance specification for the measured width or space.
- Image resolution: To limit measurement error, each width or space should contain at least 10 pixels; measurers must report resolution and pixel size.
- Measurement methods: Software-based edge recognition to determine two-dimensional coordinates of pattern edges; procedures for extracting minimum, maximum and mean width and minimum, maximum and mean space.
- Atmospheric conditioning: Standard atmospheres for evaluation and storage are specified (e.g., 23 ±2 °C and 50 ±10 % RH for general specimens; tighter classes for polymer and paper substrates as per ISO 291/ISO 187).
- Reporting: Mandatory reporting of measurement identification, atmospheric conditions, instrument system specifications, specimen information, ROI and results (see example reporting items in Table 1 of the standard).
- Illustrative guidance: Figures and an informative annex clarify image ROIs, profile generation, width/space variation and effects of inclination.
Practical applications
- Process control and printability assessment for inkjet, gravure, flexography and other printed electronics processes.
- Quality assurance and acceptance testing for printed conductive traces, sensors, antennas and interconnect lines.
- Metrology and testing labs establishing standardized measurement routines and reports.
- R&D for formulation, printhead design, substrate selection and reliability studies where line geometry affects device performance.
Who should use this standard
- Printed electronics manufacturers and suppliers
- Quality and process engineers in additive manufacturing and printed circuitry
- Test laboratories and certification bodies
- R&D teams working on printed sensors, displays, and flexible electronics
Related standards
Refer to related parts of the IEC 62899 series and the cited atmospheric standards (ISO 291, ISO 187) for conditioning and other measurement domains such as vertical variance.
Open preview (PDF)Printed electronics - Part 402-1: Printability - Measurement of qualities - Line pattern widths
