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IEC TS 62454:2007 PDF

Mechanical structures for electronic equipment - Design guide: Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series

First page of standard IEC TS 62454:2007Open preview (PDF)Mechanical structures for electronic equipment - Design guide: Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series
Title (English):
IEC TS 62454:2007

Mechanical structures for electronic equipment - Design guide: Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series

Document status:
Active
Format:
Electronic (PDF)
Number of pages:
41
Publication date:
October 10, 2007
Edition:
IEC TS 62454 edition 1 version 1
ICS:
31.240
Description (English):

Provides interface dimensions and cooling performance guidelines for cabinets, using water supplied heat exchangers. Is applicable to cabinets in accordance with the IEC 60297 (19 in) and IEC 60917 (25 mm) series.

Technical details

Technical committee
SC 48D - Mechanical structures for electrical and electronic equipment
SKU
IEC TS 62454:2007

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