BS EN IEC 63378-3:2025 PDF

Thermal standardization on semiconductor packages - Thermal circuit simulation models of discrete semiconductor packages for transient analysis

First page of standard BS EN IEC 63378-3:2025

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Title (English):

BS EN IEC 63378-3:2025

Thermal standardization on semiconductor packages - Thermal circuit simulation models of discrete semiconductor packages for transient analysis

Document status:: Active
Format:: Electronic (PDF)
Publication date:: June 30, 2025
ICS:: 31.080.01
Technical committee:: CENELEC
SKU:: BS EN IEC 63378-3:2025

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Abstract

1 Scope

This part of IEC 63378 specifies the thermal circuit network model of discrete (TO-243, TO-252 and TO-263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification. This model is intended to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.

Related standards

Mentioned in the description and other BS standards

BS EN IEC 63378-3:2025 PDF

Abstract

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Abstract

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