BS IEC 62047-27:2017 PDF

Semiconductor devices. Micro-electromechanical devices - Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

Open preview (PDF)Semiconductor devices. Micro-electromechanical devices - Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

Title (English):

BS IEC 62047-27:2017

Semiconductor devices. Micro-electromechanical devices - Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

Document status:

Active

Format:

Electronic (PDF)

Publication date:

July 31, 2020

ICS:

31.080.99

Technical committee:

CENELEC

SKU:

BS IEC 62047-27:2017